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Li, Tuoqi, et al. Macromolecules 49.24 (2016): 9507-9520.
Ethyltriphenylphosphonium acetate (ETPPA) is an effective catalyst used in the curing of thermoset epoxy composites, facilitating cross-linking reactions that enhance mechanical properties. In the preparation of epoxy-based composites incorporating exfoliated graphene oxide modified with amine-terminated poly(butadiene-acrylonitrile) (GA) and poly(ethylene oxide)-b-poly(ethylene-alt-propylene) (OP) diblock copolymer, ETPPA plays a critical role in promoting resin polymerization.
The curing process involves sequential heating steps to ensure complete solvent removal before the introduction of ETPPA. The catalyst is added after thorough resin formulation mixing, followed by rapid integration for 1-2 minutes before transferring the resin to a preheated mold. Curing at 200 °C for 2 hours under controlled conditions ensures optimal cross-link density and composite integrity.
ETPPA's catalytic efficiency directly influences the thermomechanical performance of the resulting epoxy network. Its controlled activation enables tailored curing kinetics, impacting composite toughness and microstructure. This study highlights ETPPA's essential function in epoxy resin chemistry, demonstrating its significance in high-performance composite applications.
Zhao, Fangqiao, et al. Journal of Applied Polymer Science 134.26 (2017).
Ethyltriphenylphosphonium acetate (ETPPA) is a widely used curing catalyst in epoxy-based thermosets, promoting efficient cross-linking reactions essential for enhancing mechanical properties. In the synthesis of epoxy-amphiphilic random copolymer (PHGEL)-modified diglycidyl ether of bisphenol A (DGEBA) thermosets, ETPPA plays a crucial role in ensuring optimal polymerization.
The curing process follows a controlled thermal cycle, beginning with solvent removal and pre-curing under vacuum, followed by sequential heating at 80 °C, 100 °C, 120 °C, and 140 °C to achieve complete resin cross-linking. The addition of ETPPA facilitates precise reaction kinetics, ensuring uniform polymer network formation. Its catalytic activity is particularly important in epoxy formulations incorporating toughening agents such as PHGEL, which require careful control of phase separation and network morphology.
The inclusion of ETPPA in epoxy thermoset formulations results in improved mechanical performance, optimizing toughness while maintaining thermal stability. This study underscores the significance of ETPPA as a highly effective catalyst in advanced epoxy-based composite materials, demonstrating its critical role in modern polymer engineering.
Wei, Wei, et al. Journal of Applied Polymer Science 137.34 (2020): 48986.
Ethyltriphenylphosphonium acetate (ETPPA) plays a crucial role as a curing accelerator in epoxy thermosets, enhancing cross-linking efficiency and optimizing polymer network formation. In this study, ETPPA was utilized to catalyze the curing of an epoxy resin system modified with silica-styrene-maleic anhydride (SiO₂-SMA) particles.
The preparation process began by ultrasonically dispersing SiO₂-SMA particles in acetone, ensuring uniform dispersion. This suspension was then mixed with 48 g of epoxy resin under magnetic stirring for 3 hours. The solvent was completely evaporated by heating the mixture at 50 °C overnight. Once cooled to room temperature, a curing agent, methylhexahydrophthalic anhydride (MHHPA, 43.2 g), and ETPPA (3.2 g, 70% methanol solution) were added. The mixture was stirred until all components were fully dissolved, with ETPPA added at 2 wt% of the epoxy resin to facilitate efficient curing.
To remove any residual solvent, the formulation was degassed under vacuum at 40 °C for 2 hours before being poured into a preheated mold. The curing process followed a multi-step schedule: 80 °C for 1.5 hours, 100 °C for 1 hour, 120 °C for 1 hour, and a final curing step at 140 °C for 4 hours.
ETPPA significantly enhanced the curing kinetics and thermal stability of the thermoset, ensuring a robust polymer matrix. Its catalytic effect contributed to improved mechanical properties, making it a key component in advanced epoxy composite formulations.
